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Abstract GeSn photodetectors monolithically grown on Ge virtual substrates demonstrate mid‐wave infrared (MWIR) detection at room temperature. The lattice mismatch between GeSn and Ge causes dislocations and compressive strain, creating leakage pathways and unwanted indirect band transitions. Designed thin Ge_0.91Sn_0.09triple‐step buffer layers of ≈175 nm total thickness reduce dislocations and enable full relaxation, showing 100% lattice relaxation and smooth surface roughness of 0.83 nm with shorter auto‐correlation length in surface morphology compared to single‐step buffers. Ge_1‐xSn_xphotodetectors (x= 0.09, 0.12, and 0.15) on triple‐step buffers withn‐i‐pconfigurations achieve lattice strain relaxations of 99%, 88%, and 80%, respectively. Ge_0.91Sn_0.09and Ge_0.88Sn_0.12show gradual variation in auto‐correlation amplitude, while Ge_0.85Sn_0.15shows an increase due to lattice mismatch. Shockley–Read–Hall recombination current dominates at low reverse bias due to mismatch‐induced dislocations, while band‐to‐band tunneling current dominates at higher reverse bias due to narrowing bandgap under strong electric fields. The photodetectors show extended spectral response with increasing Sn composition ofi‐GeSn active layer sandwiched by barriers. Ge_0.88Sn_0.12and Ge_0.85Sn_0.15exhibit extended wavelength cut‐offs of 3.12 and 3.27 µm at room temperature, demonstrating significant potential for silicon‐based MWIR applications. 

Time-of-Flight Secondary Ion Mass Spectrometry (ToF-SIMS) is a powerful technique for elemental compositional analysis and depth profiling of materials. However, it encounters the problem of matrix effects that hinder its application. In this work, we introduce a pioneering ToF-SIMS calibration method tailored for SixGeySnz ternary alloys. SixGe1-x and Ge1-zSnz binary alloys with known compositions are used as calibration reference samples. Through a systematic SIMS quantification study of SiGe and GeSn binary alloys, we unveil a linear correlation between secondary ion intensity ratio and composition ratio for both SiGe and GeSn binary alloys, effectively mitigating the matrix effects. Extracted relative sensitivity factor (RSF) value from SixGe1-x (0.07<0.83) and Ge1-zSnz (0.066<0.183) binary alloys are subsequently applied to those of SixGeySnz (0.011<0.113, 0.863<0.935 and 0.023<0.103) ternary alloys for elemental compositions quantification. These values are cross-checked by Atom Probe Tomography (APT) analysis, an indication of the great accuracy and reliability of as-developed ToF-SIMS calibration process. The proposed method and its reference sample selection strategy in this work provide a low-cost as well as simple-to-follow calibration route for SiGeSn composition analysis, thus driving the development of next-generation multifunctional SiGeSn-related semiconductor devices. 

We experimentally demonstrate a low-cost transfer process of GeSn ribbons to insulating substrates for short-wave infrared (SWIR) sensing/imaging applications. By releasing the original compressive GeSn layer to nearly fully relaxed state GeSn ribbons, the room-temperature spectral response of the photodetector is further extended to 3.2 μm, which can cover the entire SWIR range. Compared with the as-grown GeSn reference photodetectors, the fabricated GeSn ribbon photodetectors have a fivefold improvement in the light-to-dark current ratio, which can improve the detectivity for high-performance photodetection. The transient performance of a GeSn ribbon photodetector is investigated with a rise time of about 40 μs, which exceeds the response time of most GeSn (Ge)-related devices. In addition, this transfer process can be applied on various substrates, making it a versatile technology that can be used for various applications ranging from optoelectronics to large-area electronics. These results provide insightful guidance for the development of low-cost and high-speed SWIR photodetectors based on Sn-containing group IV low-dimensional structures.